Ufs: Bga 254 Datasheet __full__

BGA stands for , a type of surface-mount packaging used for integrated circuits. The "254" refers to the number of solder balls (pins) on the bottom of the chip.

The UFS BGA 254 package is a compact, surface-mount package with 254 solder balls arranged in a grid pattern on the bottom side of the package. The package measures 12mm x 8mm in size, making it suitable for use in small form factor devices. Ufs Bga 254 Datasheet